Description Electronic Blister Packaging – Siemens
1. Materials : HIPS, HIPS conductive, PP, PET antistatic, PET conduction printing, PVC, PS, GAG and PETG.
2. Suitable for packing various kinds of electronic products, semi-finished products and components.
3. Excellent and innovative design, precision tooling, anti-static or Conductive materials for maximum protection and showcasing.
4. Available in various sizes and shapes – OEM/ODM service to suit customer’s specification.